Micro-Ultrasonic/Thermosonic Welding

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Micro-Ultrasonic/Thermosonic Welding

Process:

The ultrasonic welding process is a solid state (no melting of materials) welding process. The weld is produced by the application of high frequency (60KHz) vibratory energy as the parts are held together with force. The “scrubbing” action that occurs at the weld interface displaces metallic oxides, foreign materials, etc. to expose fresh clean metallic surfaces for bonding. This process is widely used in the micro-electronics industry for attachment to IC chips.

microultra_1 — Ultrasonic welded 0.001" Al wire to IC Chip

microultra_2 — High Magnification 0.001" wire on chip pad

Advantages:

Very fast process. Highly automated especially in terms of wire handling.
Very safe process. No welding arcs.
Can be used on materials which are difficult to weld with other welding processes, i.e. aluminum and copper alloys.

Materials That Have Been Ultrasonic/Thermosonic Welded:

Aluminum alloys
Copper alloys
Gold

Additional Capabilities:

Dage Series 22 system capable of wire pull, die shear, ball shear, TAB, torque and tweezer pull test functions.

Ultrasonic/Thermosonic Welding Equipment:

Model 4123 Kulicke and Soffa Wedge Bonder.
Model 4129 Kulicke and Soffa Deep Cavity Wedge Bonder.
Orthodyne Model 20 Heavy Wire Ultrasonic Bonder.
Model 4124 Kulicke and Soffa Thermosonic Ball Bonder.